Abstract
The phenomenon of melting produced by pulsed laser irradiation in silicon has been studied using electron microscopy. Removal of dopant precipitates, dislocations or loops provides clear evidence for melting. From the thickness of defect-free regions and the length of reoriented segments of dislocations, the depth of melting can be determined as a function of laser parameters. Using this technique, the depth of melting underneath the oxide layers has been investigated. Cellular structures observed in ion-implanted, laser-annealed specimens also provide convincing evidence of melting during pulsed laser irradiation.