Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling
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- 19 October 2005
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 417 (1-2), 116-120
- https://doi.org/10.1016/j.jallcom.2005.09.037
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Age-hardening characteristics of Cu–2.4Ni–0.6Si alloy produced by the spray forming processJournal of Materials Processing Technology, 2004
- Aging behavior of Cu–Ni–Si alloyMaterials Science and Engineering: A, 2003
- Precipitation in Cu–Ni–Si–Zn alloy for lead frameMaterials Letters, 2003
- Structure and strength of the age hardened Cu–Ni–Si alloyMaterials Chemistry and Physics, 2003
- Electrical and thermal conductivities in quenched and aged high-purity Cu–Ti alloysScripta Materialia, 2003
- Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloyJournal of Materials Science, 2000
- On the variation of mechanical properties with solute content in Cu–Ti alloysMaterials Science and Engineering: A, 1999
- Effect of Ti additions on the electrical resistivity of copperMaterials Science and Engineering: A, 1997
- The alloy content and grain size dependence of flow stress in CuTi alloysActa Materialia, 1996
- On the deformation characteristics of solution treated Cu-Ti alloysScripta Metallurgica et Materialia, 1995