Abstract
Model calculations are described which predict the fraction of tetrahedral (sp3) versus graphitic (sp2) bonding in ion beam or plasma‐deposited amorphous carbon films on the basis of the preferential displacement of sp2 atoms. Displacement yields obtained from static t r i m simulations are used as input data for a simple analytical growing layer model of ion beam deposition. The sp3/sp2 ratio is found to increase with increasing carbon ion energy between 30 eV and 1 keV. Assuming equal probabilities for a free (implanted or displaced) atom to become trapped at either sp2 or sp3 sites results in sp3/sp2 ratios between 1 and 3.5. More refined dynamic simulations with t r i d y n confirm the trends with slightly lower sp3/sp2 ratios for ion beam or plasma deposition, also involving hydrogen. A decrease of the sp3/sp2 ratio towards high energies cannot be explained by preferential displacement only, in contrast to proposals in recent literature.