The Effect of Joint Design on the Thermal Fatigue Life of Leadless Chip Carrier Solder Joints
- 1 December 1985
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 8 (4), 417-426
- https://doi.org/10.1109/tchmt.1985.1136540
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
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