The effect of interfacial layer properties on the performance of Hf-based gate stack devices

Abstract

The influence of Hf-based dielectrics on the underlying $\mathrm{Si}{\mathrm{O}}_2$ interfacial layer (IL) in high-$k$ gate stacks is investigated. An increase in the IL dielectric constant, which correlates to an increase of the positive fixed charge density in the IL, is found to depend on the starting, pre-high-$k$ deposition thickness of the IL. Electron energy-loss spectroscopy and electron spin resonance spectra exhibit signatures of the high-$k$ -induced oxygen deficiency in the IL consistent with the electrical data. It is concluded that high temperature processing generates oxygen vacancies in the IL responsible for the observed trend in transistor performance.