Assessments of micropackaged integrated circuits in high reliability applications
- 1 March 1983
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 14 (2), 5-25
- https://doi.org/10.1016/s0026-2692(83)80219-5
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Investigation of the molecular processes controlling corrosion failure mechanisms in plastic encapsulated semiconductor devicesMicroelectronics Reliability, 1981
- Some problems and possible solutions for hybrid microcircuit reliabilityMicroelectronics Journal, 1980
- Corrosion Failure Mechanisms for Gold Metallizations in Electronic CircuitsJournal of the Electrochemical Society, 1979
- The accelerated ageing of plastic encapsulated semiconductor devices in environments containing a high vapour pressure of waterMicroelectronics Reliability, 1974
- Thermally accelerated aging of semiconductor componentsProceedings of the IEEE, 1974