Abstract
This work is a study of the formation mechanisms of interface traps (Nit) in metal‐oxide‐semiconductor devices. The time‐dependence of the Nit formation has been measured as a function of oxide thickness following a short radiation pulse. The Nit formation time is found to increase as t2.6ox when the gate bias is negative during irradiation and positive afterward. This result is in excellent agreement with predictions of a hydrogen transport model where drift of hydrogen ions (H+) is the rate‐limiting step. When the gate bias during irradiation is positive, interpretation of the correlation between data and model suggests that the hydrogen ions are preferentially created near the Si‐SiO2 interface. Finally, the Nit formation time is found to decrease with increasing oxide field as E−1.73ox. This result is compatible with the hydrogen transport model if the average displacement per hop is assumed to be proportional to Em.