Fabrication of 300-Å metal lines with substrate-step techniques

Abstract
Metal lines as narrow as 30 nm and as long as 0.5 mm have been fabricated by new techniques based on substrates with surface‐relief steps. Substrate steps with a square profile are formed by ion‐beam etching. Metal wires of triangular cross section are produced by ion‐etching a metal‐coated substrate at an angle, so that the wire is formed in the shadow of the step. An alternative process, direct evaporation onto the step edge, is used to produce lines of very high aspect ratio of height to width.