Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
- 1 September 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (3), 232-237
- https://doi.org/10.1109/tchmt.1983.1136183
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip CarriersCircuit World, 1982
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Thermal Stress and Low Cycle FatigueJournal of Applied Mechanics, 1966