Microstructing of silicon by electro-discharge machining (EDM) — part II: applications
- 1 June 1997
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 61 (1-3), 379-386
- https://doi.org/10.1016/s0924-4247(97)80293-2
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Modular Method for Microparts Machining and Assembly with Self-AlignmentCIRP Annals, 1995
- Fabrication of 45° mirrors together with well-defined v-grooves using wet anisotropic etching of siliconJournal of Microelectromechanical Systems, 1995
- Extremely miniaturized capacitive movement sensors using new suspension systemsSensors and Actuators A: Physical, 1994
- Investigation of silicon wafering by wire EDMJournal of Materials Science, 1992
- Development of Pocket-size Electro-Discharge MachineCIRP Annals, 1991
- Drilling of Deep Microholes by EDMCIRP Annals, 1989
- Semiconducting wafer form shaping with an electric discharge machineReview of Scientific Instruments, 1988
- Current Trends in Non-Conventional Material Removal ProcessesCIRP Annals, 1986