SPUTTERING OF OXIDE FILMS IN PLASMA ANODIZATION OF ALUMINUM
- 1 June 1968
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 12 (11), 396-397
- https://doi.org/10.1063/1.1651871
Abstract
Oxide films on aluminum can be sputtered off in oxygen or in argon glow discharges, when a positive bias is applied to the specimen. It is shown that this phenomenon limits the thickness of films that can be grown by plasma anodization. The sputtering does not necessarily require negative ions, since these are absent in the argon discharge.Keywords
This publication has 4 references indexed in Scilit:
- SPUTTERING DUE TO NEGATIVE OXYGEN IONS IN OXYGEN DISCHARGESApplied Physics Letters, 1968
- Fluorescent Properties of Some Europium-Activated PhosphorsJournal of the Electrochemical Society, 1964
- Plasma Anodized Aluminum Oxide FilmsJournal of the Electrochemical Society, 1964
- The Formation of Metal Oxide Films Using Gaseous and Solid ElectrolytesJournal of the Electrochemical Society, 1963