Electroplated solder joints for flip-chip applications
- 1 January 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (3), 549-559
- https://doi.org/10.1109/33.83943
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
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