VLSI Chip Interconnection Technology Using Stacked Solder Bumps
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4), 566-570
- https://doi.org/10.1109/tchmt.1987.1134795
Abstract
No abstract availableKeywords
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