Tensile behavior of 40nm Cu/Nb nanoscale multilayers
- 11 January 2008
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 58 (10), 874-877
- https://doi.org/10.1016/j.scriptamat.2008.01.005
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- The effects of decreasing layer thickness on the high temperature mechanical behavior of Cu/Nb nanoscale multilayersThin Solid Films, 2006
- Preparation of high strength bulk nano-scale Fe/Cu multilayers by repeated pressing-rollingJournal of Materials Science Letters, 2001
- Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayersActa Materialia, 2000
- Tensile testing low density multilayers: Aluminum/titaniumJournal of Materials Research, 1998
- Structure and mechanical properties of Cu-X (X = Nb,Cr,Ni) nanolayered compositesScripta Materialia, 1998
- Tensile Properties of Nanostructured Ni‐Cu Multilayered Materials Prepared by ElectrodepositionJournal of the Electrochemical Society, 1991
- The mechanical properties of laminated microscale composites of Al/Al2O3Journal of Materials Science, 1990
- Wavelength‐Property Correlation in Electrodeposited Ultrastructured Cu‐Ni MultilayersJournal of the Electrochemical Society, 1990
- Enhanced tensile strength for electrodeposited nickel-copper multilayer compositesMetallurgical Transactions A, 1984
- Strength enhancement in thin-layered Al-Cu laminatesJournal of Applied Physics, 1978