Comments on the analysis of thermal grooving data
- 1 June 1972
- journal article
- research article
- Published by Springer Nature in Metallurgical Transactions
- Vol. 3 (6), 1672-1675
- https://doi.org/10.1007/bf02643066
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Diffusion of helium gas bubbles in gold and copper foilsMetallurgical Transactions, 1970
- Detection of deformation and cracking on oxide and coated surfaces by light microscopyMetallurgical Transactions, 1970
- Interpretation of thermal grooving data for copperMetallurgical Transactions, 1970
- The surface self-diffusion of copper as affected by environmentActa Metallurgica, 1964
- The kinetics of grain boundary grooving in copperActa Metallurgica, 1959
- Self-Diffusion in CopperPhysical Review B, 1954