A series of demonstrators to assess technologies for silicon hybrid multichip modules
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 557-561
- https://doi.org/10.1109/ecc.1989.77805
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Ultra-reliable packaging for silicon-on-silicon WSIPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003