Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures
- 30 April 1996
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 52 (1-3), 132-139
- https://doi.org/10.1016/0924-4247(96)80138-5
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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