A circuit topology for microwave modeling of plastic surface mount packages
- 1 July 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 44 (7), 1140-1146
- https://doi.org/10.1109/22.508649
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- The inductive connection effects of a mounted SPDT in a plastic SO8 packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packagingIEEE Microwave and Guided Wave Letters, 1995
- Wideband characterization of mutual coupling between high density bonding wiresIEEE Microwave and Guided Wave Letters, 1994
- Synthesis of lumped models from N-port scattering parameter dataIEEE Transactions on Microwave Theory and Techniques, 1994