Representation of thermal behavior of electronic components for the creation of a databank
- 1 June 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (2), 366-373
- https://doi.org/10.1109/33.87317
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Package thermal resistance model: dependency on equipment designIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermal characterization of plastic and ceramic surface-mount componentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermal Characteristics of Plastic Small Outline Transistor (SOT) PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Thermal Resistance: A Reliability ConsiderationIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980