Meta‐bromobiphenol epoxy resins: Applications in electronic packaging and printed circuit board
- 5 October 1991
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 43 (7), 1315-1321
- https://doi.org/10.1002/app.1991.070430713
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Chemistry of Stable Brominated EpoxiesPublished by American Chemical Society (ACS) ,1989
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- Some structure‐property relationships in polymer flammability: Studies of phenolic‐derived polymersJournal of Applied Polymer Science, 1982
- Thermal decomposition of 4,4′-isopropylidene bis-2,6-dibromophenol (tetrabromobisphenol-A)Journal of Polymer Science: Polymer Chemistry Edition, 1973
- Thermal Degradation and Flame Resistivity of Tetrabrominated Epoxy ResinJournal of Macromolecular Science: Part A - Chemistry, 1971