Ternary amorphous metallic thin films as diffusion barriers for Cu metallization
- 1 October 1995
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 91 (1-4), 269-276
- https://doi.org/10.1016/0169-4332(95)00130-1
Abstract
No abstract availableThis publication has 27 references indexed in Scilit:
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