Young s modulus measurements of silicon nanostructures using a scanning probe system: a non-destructive evaluation approach
- 19 November 2003
- journal article
- Published by IOP Publishing in Smart Materials and Structures
- Vol. 12 (6), 1028-1032
- https://doi.org/10.1088/0964-1726/12/6/023
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Mechanical behavior of structures for microelectromechanical systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFMJournal of Microelectromechanical Systems, 2000
- Quantized thermal conductance: measurements in nanostructuresPhysica B: Condensed Matter, 2000
- Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin filmsJournal of Microelectromechanical Systems, 1998
- A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperatureJournal of Microelectromechanical Systems, 1998
- Attonewton force detection using ultrathin silicon cantileversApplied Physics Letters, 1997
- A new technique for measuring the mechanical properties of thin filmsJournal of Microelectromechanical Systems, 1997
- Fabrication of high frequency nanometer scale mechanical resonators from bulk Si crystalsApplied Physics Letters, 1996
- Fracture testing of silicon microcantilever beamsJournal of Applied Physics, 1996
- Micromechanical fracture strength of siliconJournal of Applied Physics, 1990