A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 7 (3), 339-344
- https://doi.org/10.1109/84.709653
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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