Stress relaxation in thin aluminium films
- 1 September 1986
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 142 (2), 199-212
- https://doi.org/10.1016/0040-6090(86)90005-2
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- Stress relaxation and hillock growth in thin filmsActa Metallurgica, 1982
- The influence of stacking fault energy on creepActa Metallurgica, 1982
- On the Diffusion of Excess Vacancies to Free Surfaces and Voids in Thin FilmsJournal of the Electrochemical Society, 1978
- Thermal strain in lead thin films II: strain relaxation mechanismsThin Solid Films, 1978
- Strain-relaxation in thin films on substratesActa Metallurgica, 1974
- On the empirical constants in the dorn equationScripta Metallurgica, 1973
- A first report on deformation-mechanism mapsActa Metallurgica, 1972
- Hillock Growth on Vacuum Deposited Aluminum FilmsJournal of Vacuum Science and Technology, 1972
- Mechanisms of Stress Relief in Polycrystalline FilmsIBM Journal of Research and Development, 1969
- Effect of Elastic Strain on the Superconducting Critical Temperature of Evaporated Tin FilmsJournal of Applied Physics, 1962