Influence of Foreign Solute Atoms on Stage I Recovery in Electron-Irradiated Copper

Abstract

Additions of 0.1 at.% B3, 0.1 at.% Ag and 0.03, 0.1, 0.3, and 1.0 at.% Au in copper are observed to suppress recovery of electrical resistivity in stage I (below 60°K) following electron irradiation. The effects of Ag and Au are essentially the same; Be is considerably more effective in suppressing stage I recovery. The effects of composition of Au is evaluated. It appears from this evaluation that close-pair recombination is accomplished with only one or two jumps, on the average, and that other recovery processes in stage I involve appreciably more jumps. The number of potential trapping sites associated with each Au atom appears to be over 30 and may approach 100.