Determination of the Weighted-Average Case Temperature for a Single Chip Package

Publisher Website

1 January 1994

book chapter
Published by Springer Nature

p. 789-809
https://doi.org/10.1007/978-94-011-1090-7_30

Abstract

No abstract available

Keywords

This publication has 1 reference indexed in Scilit:

Representation of thermal behavior of electronic components for the creation of a databank
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991

Cited by 9 articles