Effects of Silver‐Paste Formulation on Camber Development during the Cofiring of a Silver‐Based, Low‐Temperature‐Cofired Ceramic Package
- 1 November 1998
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 81 (11), 2805-2814
- https://doi.org/10.1111/j.1151-2916.1998.tb02700.x
Abstract
No abstract availableKeywords
This publication has 20 references indexed in Scilit:
- Cofiring Kinetics and Mechanisms of an Ag‐Metallized Ceramic‐Filled Glass Electronic PackageJournal of the American Ceramic Society, 1997
- Effect of Densification Mismatch on Camber Development during Cofiring of Nickel‐Based Multilayer Ceramic CapacitorsJournal of the American Ceramic Society, 1997
- Principles of the development of a silica dielectric for microelectronics packagingJournal of Materials Research, 1996
- Design of low dielectric glass+ceramics for multilayer ceramic substrateIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Effect of Mismatched Sintering Kinetics on Camber in a Low‐Temperature Cofired Ceramic PackageJournal of the American Ceramic Society, 1993
- Flaw Generation During Constrained Sintering of Metal‐Ceramic and Metal–Glass Multilayer FilmsJournal of the American Ceramic Society, 1989
- Low dielectric constant multilayer glass-ceramic substrate with Ag-Pd wiring for VLSI packageIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Low Dielectric Constant, Alumina-Compatible, Co-Fired Multilayer SubstratePublished by Wiley ,1988
- Low Firing Temperature Multilayer Glass-Ceramic SubstrateIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The Elastic Constants of a Solid containing Spherical HolesProceedings of the Physical Society. Section B, 1950