Cosintering process for glass-ceramic/copper multilayer ceramic substrate
- 1 January 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (4), 780-783
- https://doi.org/10.1109/33.105133
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Thermal Conduction Module: A High-Performance Multilayer Ceramic PackageIBM Journal of Research and Development, 1982