Experimental electrical characterization of high speed interconnects
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The authors present measurement techniques to experimentally characterize the electrical performance of interconnects on printed circuit boards and multichip modules. Novel techniques for calibrated measurements of two-port and three-port structures are presented. Measurements of a transmission line, a via, and a tee on a printed circuit board are presented.Keywords
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