Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding
- 5 June 2004
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 14 (7), 1047-1056
- https://doi.org/10.1088/0960-1317/14/7/027
Abstract
No abstract availableKeywords
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