Transient Thermal Analysis of Solid-State Power Devices--Making a Dreaded Process Easy
- 1 July 1976
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Industry Applications
- Vol. IA-12 (4), 405-420
- https://doi.org/10.1109/tia.1976.349444
Abstract
In spite of its importance in the rating and reliable application of power diodes and thyristors, the computation of instantaneous junction temperature has been a poorly understood and generally dreaded process among equipment designers. Under many practical circumstances, it has only been feasible by means of lengthy computer programs.Keywords
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