Electromechanical devices utilizing thin Si diaphragms
- 1 November 1977
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 31 (9), 618-619
- https://doi.org/10.1063/1.89802
Abstract
Heavy boron diffusion followed by selective etching has been used to produce uniform edge‐supported Si diaphragms with thickness in the 1–3‐μ range and areas up to 5 cm2. These diaphragms have numerous applications in the fabrication of rugged reliable electromechanical devices which are compatible with IC technology. In this paper we describe the performance of an electrically tunable resonant cavity which operates in the 10–12‐kHz range with Q as high as 23 000. Devices based on this cavity structure include pressure transducers, microphones, speakers, tunable filters, and oscillators.Keywords
This publication has 3 references indexed in Scilit:
- Auger investigation of boron‐doped SiO2/SiJournal of Vacuum Science and Technology, 1977
- Schottky diodes and other devices on thin silicon membranesIEEE Transactions on Electron Devices, 1976
- Optimization of the Hydrazine‐Water Solution for Anisotropic Etching of Silicon in Integrated Circuit TechnologyJournal of the Electrochemical Society, 1975