A new in-situ approach to flip-chip interconnect characterization up to millimeter wave frequencies
- 6 April 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
In this paper we present the performance of flip-chip interconnects up to 40 GHz based on an alternative non-destructive measurement technique. The presented method unfolds the raw flip-chip interconnect, excluding any launch structures for an actually mounted silicon chip. A preliminary modeling approach for chip-package co-design is outlined.Keywords
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