Effects of reaction kinetics on the microstructure of chemical vapour deposited copper films: experiment and simulation
- 31 August 1997
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 305 (1-2), 52-60
- https://doi.org/10.1016/s0040-6090(97)00189-2
Abstract
No abstract availableKeywords
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