Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-on-insulator substrates
- 31 August 1995
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 50 (1-2), 99-103
- https://doi.org/10.1016/0924-4247(96)80091-4
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Surface micromachined structures fabricated with silicon fusion bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Deep trenches in silicon using photoresist as a maskSensors and Actuators A: Physical, 1993
- A bulk silicon dissolved wafer process for microelectromechanical devicesJournal of Microelectromechanical Systems, 1992
- IC-processed electrostatic micromotorsSensors and Actuators, 1989
- Laterally Driven Polysilicon Resonant MicrostructuresSensors and Actuators, 1989
- Integrated fabrication of polysilicon mechanismsIEEE Transactions on Electron Devices, 1988
- Integrated movable micromechanical structures for sensors and actuatorsIEEE Transactions on Electron Devices, 1988
- Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)Microelectronic Engineering, 1986