Three-dimensional high-frequency distribution networks. II. Packaging and integration
- 1 January 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 48 (10), 1643-1651
- https://doi.org/10.1109/22.873891
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Experimental results on microshield transmission line circuitsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Micromachined silicon conformal packaging for millimeter wave system applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Mode conversion at GCPW-to-microstrip-line transitionsIEEE Transactions on Microwave Theory and Techniques, 2000
- Three-dimensional high-frequency distribution networks. I. Optimization of CPW discontinuitiesIEEE Transactions on Microwave Theory and Techniques, 2000
- Si-micromachined coplanar waveguides for use in high-frequency circuitsIEEE Transactions on Microwave Theory and Techniques, 1998
- Spatial power combining for two-dimensional structuresIEEE Transactions on Microwave Theory and Techniques, 1998
- Micromachined patch antennasIEEE Transactions on Antennas and Propagation, 1998
- Open- and short-circuit terminated series stubs in finite-width coplanar waveguide on siliconIEEE Transactions on Microwave Theory and Techniques, 1997
- A 16-element subarray for hybrid-circuit tile-approach spatial power combiningIEEE Transactions on Microwave Theory and Techniques, 1996
- Development of self-packaged high frequency circuits using micromachining techniquesIEEE Transactions on Microwave Theory and Techniques, 1995