Electrical Characteristics of Copper/Polyimide Thin-Film Multilayer Interconnects
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4), 577-585
- https://doi.org/10.1109/tchmt.1987.1134780
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Electrical CAD Analysis for Multilayer Package DesignMicroelectronics International, 1987
- Packaging Technology for the NEC SX SupercomputerIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Copper/polyimide Materials System for High Performance PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Properties of Thin Polyimide FilmsJournal of the Electrochemical Society, 1980