Energy based methodology for damage and life prediction of solder joints under thermal cycling
- 1 January 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 17 (4), 626-631
- https://doi.org/10.1109/96.338733
Abstract
No abstract availableKeywords
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