Fundamental study of electrically conductive adhesives (ECAs)
- 1 January 1997
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Electrical conduction models for isotropically conductive adhesive jointsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- The effect of pressure on the initial establishment of conductive paths in electronically conductive adhesivesJournal of Adhesion Science and Technology, 1996
- Development of Electrical Conduction in Silver-filled Epoxy AdhesivesThe Journal of Adhesion, 1979