Global Wiring by Simulated Annealing
- 1 October 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
- Vol. 2 (4), 215-222
- https://doi.org/10.1109/tcad.1983.1270039
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Optimization by Simulated AnnealingScience, 1983
- Thermal Conduction Module: A High-Performance Multilayer Ceramic PackageIBM Journal of Research and Development, 1982
- Circuit layoutProceedings of the IEEE, 1981
- Equation of State Calculations by Fast Computing MachinesThe Journal of Chemical Physics, 1953