Novel techniques for millimeter-wave packages
- 1 July 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 43 (7), 1516-1523
- https://doi.org/10.1109/22.392909
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Compact bandpass filters with improved stop-band characteristics using planar multilayer structuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Millimetre wave receiver components using packaged HEMTsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Multi-element multi-layer packaging for phased array antenna applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A multilayered package technology for MMICsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A novel concept for MM-wave MMIC interconnects and packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A full-wave analysis of shielded microstrip line-to-line transitionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 26 GHz-band full MMIC transmitters and receivers using a uniplanar techniquePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Broadband vertical interconnects using slot-coupled shielded microstrip linesIEEE Transactions on Microwave Theory and Techniques, 1992
- Basic blocks for high-frequency interconnects: theory and experimentIEEE Transactions on Microwave Theory and Techniques, 1988
- Numerical Solution of Steady-State Electromagnetic Scattering Problems Using the Time-Dependent Maxwell's EquationsIEEE Transactions on Microwave Theory and Techniques, 1975