Chemically Bonded Porogens in Methylsilsesquioxane
Open Access
- 1 January 2002
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 149 (12), F161-F170
- https://doi.org/10.1149/1.1515281
Abstract
Porous methylsilsesquioxane (MSQ, CH3SiO1.5)CH3SiO1.5) films were created by making polymer blends with trimethoxysilyl norbornene (TMSNB) and triethoxysilyl norbornene (TESNB), where the polymer served as a sacrificial place-holder. Upon exposure to elevated temperatures, the polymers decomposed within the MSQ matrix to form nanosize voids in the films. Different pore microstructures were observed by transmission electron microscopy and atomic force microscopy, depending on the functional groups on the polymeric sacrificial material used. The differences in microstructure have been correlated to variations in the chemical reactivity between the sacrificial polymer and the MSQ matrix. Solid-state 29Si29Si and 13C13C nuclear magnetic resonance, and Fourier transform infrared spectroscopy have been used to study the chemical structure of the TMSNB and TESNB:MSQ mixtures. Indications of a chemical bond between the TMSNB and the MSQ have been found in these mixtures; however, the same results were not observed for the TESNB system. The addition of an acid catalyst to the TESNB was found to induce a reaction between the TESNB sacrificial polymer and the MSQ. The percent weight loss of the MSQ and its mixtures (with TMSNB and TESNB) were used to evaluate the polymer residue. © 2002 The Electrochemical Society. All rights reserved.Keywords
This publication has 18 references indexed in Scilit:
- In situ and ex situ FTIR–ATR and Raman microscopic studies of organosilane hydrolysis and the effect of hydrolysis on silane diffusion through a polymeric filmJournal of Applied Polymer Science, 2001
- Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applicationsJournal of Microelectromechanical Systems, 2001
- Porous Methylsilsesquioxane for Low-k Dielectric ApplicationsElectrochemical and Solid-State Letters, 2001
- Hyperbranched Polyesters as Nanoporosity Templating Agents for OrganosilicatesMacromolecules, 2000
- Catalyzed Nonhydrolytic Sol-Gel Route to Organosilsesquioxane GelsJournal of Sol-Gel Science and Technology, 1999
- In Situ Characterization of Methylsilsesquioxane CuringJournal of the Electrochemical Society, 1998
- Templating Nanopores Into Poly(MethylSilsesquioxane): New Lowdielectric Coatings Suitable for MicroElectronic ApplicationsMRS Proceedings, 1998
- Properties of New Low Dielectric Constant Spin-on Silicon Oxide based PolymersMRS Proceedings, 1997
- Structure and Dynamics of a Colloidal Silica−Poly(methyl methacrylate) Composite by 13C and 29Si MAS NMR SpectroscopyMacromolecules, 1996
- Arylsilsesquioxane gels and related materials. New hybrids of organic and inorganic networksJournal of the American Chemical Society, 1992