Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits
- 1 September 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (3), 246-256
- https://doi.org/10.1109/tchmt.1983.1136185
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Terminal and Cooling Requirements for LSI PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981