MEMS and Si micromachined circuits for high-frequency applications
- 7 August 2002
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 50 (3), 858-866
- https://doi.org/10.1109/22.989969
Abstract
RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.Keywords
This publication has 32 references indexed in Scilit:
- A Surface Micromachined Miniature Switch For Telecommunications Applications With Signal Frequencies From DC Up To 4 GhzPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- 180 degrees lumped element hybridPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- MMIC Wilkinson couplers for frequencies up to 110 GHzPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Micromechanical membrane switches for microwave applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Multilevel finite ground coplanar line transitions for high-density packaging using silicon micromachiningPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Interconnects for a Multi-Layer Three-Dimensional Silicon ArchitecturePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2000
- Three-dimensional high-frequency distribution networks. I. Optimization of CPW discontinuitiesIEEE Transactions on Microwave Theory and Techniques, 2000
- X- and Ku-band amplifiers based on Si/SiGe HBT's and micromachined lumped componentsIEEE Transactions on Microwave Theory and Techniques, 1998
- Assembling three-dimensional microstructures using gold-silicon eutectic bondingSensors and Actuators A: Physical, 1994
- Effect of Surface Contamination on the Thermocompression Bondability of GoldIEEE Transactions on Parts, Hybrids, and Packaging, 1975