Effect of an electric field on the plastic deformation kinetics of electrodeposited Cu at low and intermediate temperatures
- 21 June 2002
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 50 (11), 2851-2866
- https://doi.org/10.1016/s1359-6454(02)00109-x
Abstract
No abstract availableKeywords
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