The yield stress of polycrystalline thin films
- 1 February 1993
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 8 (2), 237-238
- https://doi.org/10.1557/jmr.1993.0237
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substratesScripta Metallurgica et Materialia, 1992
- Separation of film thickness and grain boundary strengthening effects in Al thin films on SiJournal of Materials Research, 1992