Oxygen Embrittlement of Copper Leads
- 1 June 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 13 (2), 127-132
- https://doi.org/10.1109/tphp.1977.1135182
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The Effects of Gold and Nickel Plating Thicknesses on the Strength and Reliability of Thermocompression-Bonded External LeadsIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1975