Compensating corner undercutting in anisotropic etching of (100) silicon
- 15 June 1989
- journal article
- Published by Elsevier in Sensors and Actuators
- Vol. 18 (2), 207-215
- https://doi.org/10.1016/0250-6874(89)87019-2
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- A study on deep etching of silicon using ethylene-diamine-pyrocatechol-waterSensors and Actuators, 1986
- Corner Undercutting in Anisotropically Etched Isolation ContoursJournal of the Electrochemical Society, 1984
- The Controlled Etching of Silicon in Catalyzed Ethylenediamine‐Pyrocatechol‐Water SolutionsJournal of the Electrochemical Society, 1979
- Optimization of the Hydrazine‐Water Solution for Anisotropic Etching of Silicon in Integrated Circuit TechnologyJournal of the Electrochemical Society, 1975
- Anisotropic Etching of SiliconJournal of Applied Physics, 1969