Overlay high-density interconnect: a chips-first multichip module technology
- 1 April 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Computer
- Vol. 26 (4), 23-29
- https://doi.org/10.1109/2.206510
Abstract
A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology's IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.Keywords
This publication has 6 references indexed in Scilit:
- Testing conventional logic and memory clusters using boundary scan devices as virtual ATE channelsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- An overlay interconnect technology for 1 GHz and above MCMsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Economic impact of processing technologies on thin film MCMsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Bare chip test techniques for multichip modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The single chip versus multichip packaging option for digital CMOS in the 1990sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992