Multichip Packaging Design for VLSI-Based Systems
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4), 647-653
- https://doi.org/10.1109/tchmt.1987.1134788
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic PackagingMRS Proceedings, 1986
- Computing Inductive Noise of Chip PackagesAT&T Bell Laboratories Technical Journal, 1984
- Improved Electrical Performance Required for Future MOS PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983